Solder Paste Metrology

Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing processes. The epoxy glue dot process used to fix the location of components before the reflow soldering process shares similar requirements. the ability to import CAD file representations of the desired paste and dot locations satisfies a key ease-of-use requirement.

VIEW Engineering’s proven Benchmark and Summit systems with advanced optics provide both the programming flexibility and the metrology performance required to deploy accurate, repeatable, and highly adaptable solder paste and epoxy glue dot measurement applications.

See how our new Elements CAD-to-measure software has eliminated programming for this application!