Semiconductor Advanced Package

Metrology Applications for Semiconductor Manufacturing and Advanced Packaging

Driven by VIEW Engineering’s solutions-oriented leadership, high-performance and flexibly configurable non-contact metrology platforms have become critical parts of today’s leading-edge semiconductor manufacturing and advanced packaging production environments.

Whether the specific application requires large or small stage work areas, VIEW’s proven Pinnacle, Benchmark, and Summit systems offer a wide selection of precision production-oriented metrology platforms, including a full range of configurable alternatives for advanced optics and/or multi-sensing capabilities including advanced laser options.

VIEW metrology solutions are already leading the way in leading-edge non-contact quality assurance processes for demanding semiconductor manufacturing and advanced packaging applications.