Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and coplanarity. Accurate and efficient non-contact inspection of flip chips often requires advanced features such as multiple levels of magnification, Programmable Ring Light (PRL), and integrated lasers to improve inspection throughput rates.

Many leading semiconductor manufacturers have found their ideal flip chip inspection solutions to be based around VIEW’s Summit 600 system with PRL and through-the-lens (TTL) laser options.